Opportunity

MEMSI IAP 2019

A two-week hardware startup bootcamp

Sponsored by: MIT Hong Kong Innovation Node

Unleash your inner hardware entrepreneur in Hong Kong during the January Independent Activities Period (IAP).

MEMSI (MIT Entrepreneurial and Maker Skills Integrator) is a two-week hardware startup bootcamp where MIT covers travel and program expenses.

Applications for the January 2019 session are open now!

Note: There is no MEMSI program in summer 2019.

Details

  • Program dates: January 5–19, 2019 in Hong Kong
  • Application deadline: Sunday, October 14, 2018 at 8 pm

For more information and to apply, visit the MEMSI website.